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NCV8461DR2G - onsemi

Description: Short Circuit Protection; Thermal Shutdown with Automatic Restart; CMOS (3 V/5 V) Compatible Control Input; Off State Open Load Detection; Overvoltage Protection; Undervoltage Shutdown; Loss of Ground and Loss of VD Protection; ESD Protection; Reverse Battery Protection (with extternal resistor); Very Low Standby Current; AEC-Q100 Qualified

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NCV8461DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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NCV8461DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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NCV8461DR2G Details

  • Manufacturer Part Number:

    NCV8461DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.98

  • Additional Feature:

    CURRENT LIMIT:2A; THERMAL SHUTDOWN:200C

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    34 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    13.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCV8461DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a 2-layer or 4-layer board, and minimizing the distance between the device and the thermal pad or heat sink.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, use a heat sink or thermal pad, and follow proper PCB design and layout guidelines.
  • When handling the device, take precautions to prevent electrostatic discharge (ESD) damage, handle the device by the body or pins, and avoid touching the pins or leads.
  • To troubleshoot issues with the device, check the power supply voltage, ensure proper PCB layout and design, verify the input and output signals, and consult the datasheet and application notes.
  • The NCV8461DR2G has a higher current rating, lower voltage drop, and improved thermal performance compared to other similar devices, making it suitable for high-current and high-temperature applications.

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NCV8461DR2G Overview

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