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NDT014L - onsemi

Description: 2.8 A, 60 V. RDS(ON) = 0.2 Ω @ VGS = 4.5 V, RDS(ON) = 0.16 Ω @ VGS = 10 V. ; High density cell design for extremely lowRDS(ON).; High power and current handling capability in a widely used surface mount package.

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Symbol
NDT014L - onsemi - PCB symbol
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PCB Footprints
NDT014L - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - sot_223
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3D Models
NDT014L - onsemi - 3D model - SOT223 (3-Pin) - sot_223
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NDT014L Details

  • Manufacturer Part Number:

    NDT014L

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223-4 / TO-261-4

  • Manufacturer Package Code:

    318H-01

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.4

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    2.8 A

  • Drain-source On Resistance-Max:

    0.16 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    3 W

  • Pulsed Drain Current-Max (IDM):

    10 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NDT014L Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement a reliable cooling system, and consider using a heat sink or thermal interface material to reduce thermal resistance.
  • Use a human body model (HBM) ESD protection diode (e.g., onsemi's ESD9X1.5ST5G) on the input lines, and follow proper PCB design and handling practices to prevent ESD damage.
  • Yes, but be aware that the device's frequency response is limited by its internal capacitance and inductance. Use a suitable PCB layout and consider adding external components to optimize high-frequency performance.
  • Use a systematic approach to identify the root cause: check the power supply, input signals, and PCB layout. Verify that the device is operated within the recommended specifications, and consider using a thermal imaging camera to detect thermal issues.

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NDT014L Overview

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