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NDT2955 - onsemi

Description: High density cell design for extremely low RDS(ON); High power and current handling capability in a widelyused surface mount package.; RDS(ON) = 300mΩ @ VGS = -10V; -2.5A, -60V; RDS(ON) = 500mΩ @ VGS = -4.5V

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PCB Footprints
NDT2955 - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT  233
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NDT2955 - onsemi  - 3D model - SOT223 (3-Pin) - SOT  233
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NDT2955 Details

  • Manufacturer Part Number:

    NDT2955

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223-4 / TO-261-4

  • Manufacturer Package Code:

    318H-01

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.4

  • Avalanche Energy Rating (Eas):

    174 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    2.5 A

  • Drain-source On Resistance-Max:

    0.3 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    3 W

  • Pulsed Drain Current-Max (IDM):

    15 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NDT2955 Frequently Asked Questions (FAQs)

  • A good PCB layout for the NDT2955 should include a solid ground plane, wide traces for power and ground, and a thermal relief pattern under the device to facilitate heat dissipation. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, ensure that the device is properly heatsinked, and the junction temperature (Tj) is kept below the maximum rating of 150°C. Also, consider derating the device's power handling at high temperatures.
  • To prevent ESD damage, handle the device by the body or use an anti-static wrist strap. Ensure that the PCB has ESD protection diodes and resistors in the power supply lines. Use an ESD-safe workstation and follow proper ESD handling procedures.
  • Yes, the NDT2955 is qualified for automotive and high-reliability applications. However, ensure that you follow the recommended design and manufacturing guidelines, and perform thorough testing and validation to meet the specific requirements of your application.
  • To troubleshoot issues with the NDT2955, start by verifying the power supply and input voltage. Check for overheating, and ensure that the device is properly heatsinked. Use an oscilloscope to monitor the output voltage and current. Consult the datasheet and application notes for specific troubleshooting guidelines.

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NDT2955 Overview

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