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NFAL7565L4B - onsemi

Description: Low-Loss, Short-Circuit Rated IGBTs (FS4); Very Low Thermal Resistance Using Al2O3 DBC Substrate; Built-In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout; Having Separate Open-Emitter Pins from Low-Side IGBTs; Single-Grounded Power Supply; LVIC Temperature-Sensing Built-In; Isolation Rating: 2500 Vrms / 1 min.; 650 V - 75 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection

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NFAL7565L4B - onsemi - PCB symbol
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NFAL7565L4B - onsemi PCB footprint - Other - Other - NFAL7565L4B-4
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NFAL7565L4B - onsemi - 3D model - Other - NFAL7565L4B-4
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NFAL7565L4B Details

  • Manufacturer Part Number:

    NFAL7565L4B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP30, 79x30/SPM49 CAA

  • Package Description:

    DIP-30

  • Manufacturer Package Code:

    MODGR

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    11 Weeks

  • Date Of Intro:

    2019-04-05

  • Manufacturer:

    onsemi

  • YTEOL:

    9.6

  • Additional Feature:

    CONTROL SUPPLY VOLTAGE= 15V

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDMA-T30

  • JESD-609 Code:

    e3

  • Length:

    79 mm

  • Number of Functions:

    1

  • Number of Terminals:

    30

  • Output Current-Max:

    150 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Equivalence Code:

    MODULE,30LEAD,1.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    8.8 mm

  • Supply Voltage-Max (Vsup):

    400 V

  • Supply Voltage-Nom (Vsup):

    300 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Width:

    31 mm

NFAL7565L4B Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use a shielded enclosure, keep sensitive analog circuits away from the NFAL7565L4B, and ensure proper grounding and decoupling. Implement EMI filters and shielding on I/O lines as needed.
  • Use a low-ESR capacitor for decoupling, minimize lead lengths, and ensure a low-inductance path for the output. Implement a pi-filter or a common-mode choke to reduce EMI.
  • Ensure identical device configurations, synchronize the clock signals, and implement a master-slave configuration to prevent oscillations. Use a common power supply and decoupling network.

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NFAL7565L4B Overview

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