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NFAL7565L4BT - onsemi

Description: Low-Loss, Short-Circuit Rated IGBTs (FS4); Very Low Thermal Resistance Using Al2O3 DBC Substrate; Built-In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout; Having Separate Open-Emitter Pins from Low-Side IGBTs; Single-Grounded Power Supply; Thermister Built-In; Isolation Rating: 2500 Vrms / 1 min.; 650 V - 75 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection

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Symbol
NFAL7565L4BT - onsemi - PCB symbol
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PCB Footprints
NFAL7565L4BT - onsemi PCB footprint - Other - Other - DIP31, 79x30/SPM49 CAB_2021
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3D Models
NFAL7565L4BT - onsemi - 3D model - Other - DIP31, 79x30/SPM49 CAB_2021
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NFAL7565L4BT Details

  • Manufacturer Part Number:

    NFAL7565L4BT

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP31, 79x30/SPM49 CAB

  • Package Description:

    DIP-31

  • Manufacturer Package Code:

    MODGQ

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2019-04-05

  • Manufacturer:

    onsemi

  • YTEOL:

    9.6

  • Additional Feature:

    CONTROL SUPPLY VOLTAGE= 15V

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDMA-T31

  • Length:

    79 mm

  • Number of Functions:

    1

  • Number of Terminals:

    31

  • Output Current-Max:

    150 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    8.8 mm

  • Supply Voltage-Max (Vsup):

    400 V

  • Supply Voltage-Nom (Vsup):

    300 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Width:

    31 mm

NFAL7565L4BT Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Monitor the device's temperature, current, and voltage. Implement over-temperature protection (OTP), over-current protection (OCP), and under-voltage protection (UVP) to prevent damage.
  • Consult the application note and reference design for guidance on optimizing the device's performance. Consider factors such as input voltage, output current, and switching frequency.
  • Use high-quality, low-ESR capacitors and a suitable inductor with a high saturation current rating. Ensure the components are rated for the operating voltage and current.

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NFAL7565L4BT Overview

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