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NFAM3065L4B - onsemi

Description: 650 V - 30 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection; Low-Loss, Short-Circuit Rated IGBTs (FS4); Very Low Thermal Resistance Using Al2O3 DBC Substrate; Built-In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout; Single-Grounded Power Supply; Isolation Rating: 2500 Vrms / 1 min.

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PCB Footprints
NFAM3065L4B - onsemi PCB footprint - Other - Other - DIP39, 54.5x31.0 EP−2 CASE MODGX ISSUE O_2021
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3D Models
NFAM3065L4B - onsemi  - 3D model - Other - DIP39, 54.5x31.0 EP−2 CASE MODGX ISSUE O_2021
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NFAM3065L4B Details

  • Manufacturer Part Number:

    NFAM3065L4B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP39, 54.50x31.00x5.60, 1.78P EP−2

  • Package Description:

    DIP-39

  • Manufacturer Package Code:

    MODGX

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Analog IC - Other Type:

    INTELLIGENT POWER MODULE(IPM)

  • JESD-30 Code:

    R-XDIP-T39

  • Number of Terminals:

    39

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP39(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Screening Level:

    AEC-Q100

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    13.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

NFAM3065L4B Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and implement a robust thermal management system, such as a heat sink or fan.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • While the NFAM3065L4B is not specifically designed for high-humidity environments, it can still be used with proper precautions. Ensure that the device is properly sealed, and consider using conformal coating or potting to protect it from moisture.
  • The recommended storage condition for the NFAM3065L4B is in a dry, cool place, away from direct sunlight, with a temperature range of -40°C to 125°C and relative humidity below 60%.

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NFAM3065L4B Overview

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