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NFAM5065L4B - onsemi

Description: 650 V - 50 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection; Low-Loss, Short-Circuit Rated IGBTs (FS4); Very Low Thermal Resistance Using; Built-In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout; Single-Grounded Power Supply; Isolation Rating: 2500 Vrms / 1 min.

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Symbol
NFAM5065L4B - onsemi - PCB symbol
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PCB Footprints
NFAM5065L4B - onsemi PCB footprint - Other - Other - DIP39, 54.5x31.0 EP−2 CASE MODGX ISSUE O
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3D Models
NFAM5065L4B - onsemi - 3D model - Other - DIP39, 54.5x31.0 EP−2 CASE MODGX ISSUE O
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NFAM5065L4B Details

  • Manufacturer Part Number:

    NFAM5065L4B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP39, 54.50x31.00x5.60, 1.78P EP−2

  • Package Description:

    DIP-39/29

  • Manufacturer Package Code:

    MODGX

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Analog IC - Other Type:

    INTELLIGENT POWER MODULE(IPM)

  • JESD-30 Code:

    R-XDMA-T29

  • Length:

    54.5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    29

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    100 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Equivalence Code:

    MODULE,29LEAD,1.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    7.7 mm

  • Supply Current-Max (Isup):

    6 mA

  • Supply Voltage-Max (Vsup):

    400 V

  • Supply Voltage-Nom (Vsup):

    300 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Width:

    31 mm

NFAM5065L4B Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Monitor the device's current, voltage, and temperature. Implement overcurrent protection (OCP), overvoltage protection (OVP), and thermal shutdown (TSD) to prevent damage from excessive stress.
  • Consult the application note and reference design provided by onsemi. Perform thorough simulations and testing to optimize the device's performance for your specific use case.
  • Follow the recommended soldering profile and assembly guidelines provided in the datasheet. Ensure a clean and dry PCB, and use a solder with a melting point above 217°C (423°F).

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NFAM5065L4B Overview

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