Part Image

NFAP1060L3TT - onsemi

Description: A single power supply drive is enabled through the use of bootstrap circuits for upper power supplies. (externally set); Built-in under voltage protection; Thermistor for Substrate Temperature Measurement; Compact 44mm x 20.9mm single in-line package; Certification : UL Recognized (File number : E339285)

Download NFAP1060L3TT Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
NFAP1060L3TT - onsemi PCB footprint - Other - Other - SIP29 CASE 127FB
click to zoom
3D Models
NFAP1060L3TT - onsemi  - 3D model - Other - SIP29 CASE 127FB
click to zoom

NFAP1060L3TT Details

  • Manufacturer Part Number:

    NFAP1060L3TT

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SIP29 44.00x20.90x5.50, 1.27P

  • Manufacturer Package Code:

    127FB

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    39 Weeks

  • Date Of Intro:

    2019-02-05

  • Manufacturer:

    onsemi

  • YTEOL:

    10

  • Additional Feature:

    CONTROL SUPPLY VOLTAGE= 15V

  • Analog IC - Other Type:

    INTELLIGENT POWER MODULE(IPM)

  • JESD-30 Code:

    R-XSFM-T21

  • Number of Functions:

    1

  • Number of Terminals:

    21

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    SFM

  • Package Equivalence Code:

    SIP21,.06

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Supply Voltage-Max (Vsup):

    450 V

  • Supply Voltage-Nom (Vsup):

    280 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

NFAP1060L3TT Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Also, ensure that the device is not exposed to moisture or humidity.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
  • Use a TVS (Transient Voltage Suppressor) diode or a zener diode to clamp voltage transients. Ensure that the device is not exposed to voltage exceeding the maximum rating (VCC = 60V). Use a fuse or a current limiter to prevent overcurrent conditions.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended. The capacitor should be placed as close to the output pin as possible to minimize parasitic inductance.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

NFAP1060L3TT Overview

Use the download button to access the NFAP1060L3TT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NFAP1, or try a keyword search, such as Motion Control Electronics

Parts related to NFAP1060L3TT

Showing 0 results