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NFAQ0860L36T - onsemi

Description: Three-phase 8A / 600 V IGBT module with integrated drivers using DBC substrate for lower thermal resistance; Typical values: VCE(sat) = 2.4V, VF = 2.1V, ESW = 280 µJ at 8 A; Compact 29.6 mm x 18.2 mm dual in-line package; Cross-conduction protection; Adjustable over-current protection level; Integrated bootstrap diodes and resistors; Enable pin; Thermistor; Short lead length (3.4mm, module bottom to pin end)

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PCB Footprints
NFAQ0860L36T - onsemi PCB footprint - Other - Other - DIP38, 29.6x18.2 EP−4 CASE 125BS ISSUE O
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3D Models
NFAQ0860L36T - onsemi  - 3D model - Other - DIP38, 29.6x18.2 EP−4 CASE 125BS ISSUE O
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NFAQ0860L36T Details

  • Manufacturer Part Number:

    NFAQ0860L36T

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP38, 29.60x18.20x7.70, 1.00P (EP−4)

  • Package Description:

    Module-24

  • Manufacturer Package Code:

    125BS

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2020-01-07

  • Manufacturer:

    onsemi

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDMA-T24

  • Length:

    30 mm

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    16 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    4.8 mm

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    14 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    UNSPECIFIED

  • Width:

    18.2 mm

NFAQ0860L36T Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a thermal relief pattern under the device, and to connect the thermal pad to a large copper area on the bottom layer. This helps to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider using a thermal interface material (TIM) between the device and the heat sink. Additionally, ensure that the PCB is designed to withstand the high temperatures.
  • To prevent electrostatic discharge (ESD) damage, it's recommended to handle the device with ESD-protective equipment, use ESD-protected workbenches, and follow proper ESD-handling procedures. Additionally, consider adding ESD protection devices, such as TVS diodes, to the PCB design.
  • The NFAQ0860L36T is an automotive-qualified device, and it meets the requirements for high-reliability applications. However, it's essential to follow the recommended operating conditions, and to ensure that the device is used within its specified ratings and guidelines.
  • To troubleshoot issues with the device, start by verifying that the device is used within its specified ratings and guidelines. Check the PCB layout, thermal design, and power supply connections. Use thermal imaging or temperature measurement tools to identify hotspots. Consult the datasheet and application notes for guidance on troubleshooting and debugging.

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NFAQ0860L36T Overview

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