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NFAQ1060L36T - onsemi

Description: Three-phase 10 A / 600 V IGBT module with integrated drivers using DBC substrate; Typical values: VCE(sat) = 1.9V, VF = 2.4V, ESW = 400 µJ at 10 A; Compact 29.6 mm x 18.2 mm dual in-line package; Adjustable over-current protection level; Integrated bootstrap diodes and resistors; Thermistor; Short lead length (3.4mm, module bottom to pin end)

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PCB Footprints
NFAQ1060L36T - onsemi PCB footprint - Other - Other - DIP38, 29.6x18.2 EP−4 CASE 125BS ISSUE O
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NFAQ1060L36T - onsemi  - 3D model - Other - DIP38, 29.6x18.2 EP−4 CASE 125BS ISSUE O
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NFAQ1060L36T Details

  • Manufacturer Part Number:

    NFAQ1060L36T

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP38, 29.60x18.20x7.70, 1.00P (EP−4)

  • Package Description:

    Module-24

  • Manufacturer Package Code:

    125BS

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2019-11-05

  • Manufacturer:

    onsemi

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDMA-T24

  • Length:

    30 mm

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    4.8 mm

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    14 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    UNSPECIFIED

  • Width:

    18.2 mm

NFAQ1060L36T Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane, and to place thermal vias under the device to dissipate heat effectively. Additionally, keeping the PCB traces as short and wide as possible can help reduce thermal resistance.
  • To ensure proper biasing, follow the recommended biasing circuit in the datasheet, and make sure to provide a stable voltage supply to the gate driver. Also, ensure that the gate-source voltage (Vgs) is within the recommended range of 10-15V, and the drain-source voltage (Vds) is within the recommended range of 0-600V.
  • Critical parameters to monitor during operation include the drain-source voltage (Vds), drain current (Id), and junction temperature (Tj). Monitoring these parameters can help prevent overheating, overvoltage, and overcurrent conditions that can damage the device.
  • To protect the NFAQ1060L36T from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors. Additionally, follow proper soldering and assembly procedures to prevent ESD damage during manufacturing.
  • The recommended cooling method for the NFAQ1060L36T is to use a heat sink with a thermal interface material (TIM) to improve heat transfer. The heat sink should be designed to provide adequate airflow and thermal conductivity to dissipate heat effectively.

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NFAQ1060L36T Overview

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