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NFL25065L4BT - onsemi

Description: Power Driver Module IGBT 2 Phase 650 V 50 A 32-PowerDIP Module (1.370", 34.80mm)

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PCB Footprints
NFL25065L4BT - onsemi PCB footprint - Other - Other - S32CA−032 / 32LD,PDD STD, DBC, DIP TYPE (DBC AIN) CASE MODEB ISSUE O
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3D Models
NFL25065L4BT - onsemi  - 3D model - Other - S32CA−032 / 32LD,PDD STD, DBC, DIP TYPE (DBC AIN) CASE MODEB ISSUE O
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NFL25065L4BT Details

  • Manufacturer Part Number:

    NFL25065L4BT

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP-032

  • Package Description:

    DIP-32

  • Manufacturer Package Code:

    MODEB

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2019-05-13

  • Manufacturer:

    onsemi

  • YTEOL:

    9.6

  • Additional Feature:

    ALSO HAS INPUT SUPPLY VOLTAGE FROM 187VRMS TO 253 VRMS

  • Analog IC - Other Type:

    INTELLIGENT POWER MODULE(IPM)

  • JESD-30 Code:

    R-XDMA-T32

  • JESD-609 Code:

    e3

  • Length:

    60 mm

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    100 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    8.7 mm

  • Supply Voltage-Max (Vsup):

    400 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Width:

    31 mm

NFL25065L4BT Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane, placing thermal vias under the device, and using a thermal pad connected to the ground plane. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider derating the device's power handling capability at higher temperatures.
  • The NFL25065L4BT has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. A human body model (HBM) of 2 kV and a machine model (MM) of 200 V are recommended.
  • The NFL25065L4BT is rated for operation in a humidity range of 40% to 80% RH. However, it's recommended to follow proper moisture sensitivity level (MSL) handling procedures during assembly and storage to prevent damage.
  • The recommended soldering conditions for the NFL25065L4BT are a peak temperature of 260°C, a soldering time of 10 seconds, and a soldering method of wave soldering or reflow soldering.

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NFL25065L4BT Overview

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