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NFVA35065L32 - onsemi

Description: Automotive SPM in 27 pin DIP package; WW 1st Automotive qualified grade HV module (AEC−Q100, 101 & AQG(LV)324); 650 V/50 A 3−Phase IGBT Inverter with Integral Gate Drivers and Protections; 175°C guaranteed Short−Circuit Rated FS Trench IGBTs with stable EMI performance; Outstanding Thermal Resistance using AIN DBC Substrate; Separated Open−Emitter Pins from Low−Side IGBTs for Three−Phase Current Sensing; Single−Grounded Power Supply; LVIC Temperature−Sensing Built−In for Temperature Monitoring; Isolation Ra

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PCB Footprints
NFVA35065L32 - onsemi PCB footprint - Other - Other - 27LD MODULE PDD STD CASE MODCB ISSUE A
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3D Models
NFVA35065L32 - onsemi  - 3D model - Other - 27LD MODULE PDD STD CASE MODCB ISSUE A
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NFVA35065L32 Details

  • Manufacturer Part Number:

    NFVA35065L32

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP-027

  • Package Description:

    DIP-27

  • Manufacturer Package Code:

    MODCB

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    9.55

  • Additional Feature:

    CONTROL SUPPLY VOLTAGE(VCC)= 15V

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDFM-T27

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    27

  • Output Current-Max:

    100 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DFM

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Supply Voltage-Max (Vsup):

    400 V

  • Supply Voltage-Nom (Vsup):

    300 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

NFVA35065L32 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, use 10uF to 22uF, and for output capacitors, use 10uF to 47uF. Ensure the capacitors are placed close to the device pins.
  • Use a shielded enclosure, keep the device and its associated components away from the PCB edge, and use a common-mode choke or ferrite bead on the input lines. Ensure proper grounding and decoupling of the device.
  • Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before applying the enable signal.

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NFVA35065L32 Overview

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