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NGTB40N120FL2WAG - onsemi

Description: Obsolete - IGBT, 1200 V, 40 A, FS1 Solar/UPS

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NGTB40N120FL2WAG - onsemi PCB footprint - Other - Other - NGTB40N120FL2WAG-2
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NGTB40N120FL2WAG - onsemi  - 3D model - Other - NGTB40N120FL2WAG-2
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NGTB40N120FL2WAG Details

  • Manufacturer Part Number:

    NGTB40N120FL2WAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-247-4

  • Manufacturer Package Code:

    340AR

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2016-05-02

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    160 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    6.5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    536 W

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    360 ns

  • Turn-on Time-Nom (ton):

    65 ns

  • VCEsat-Max:

    2.4 V

NGTB40N120FL2WAG Frequently Asked Questions (FAQs)

  • The SOA is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance, maximum junction temperature, and voltage ratings. Consult the onsemi application note AND8199/D for guidance on SOA calculations.
  • To minimize switching losses, ensure the gate drive voltage is sufficient (typically 10-15V) and the gate resistance is minimized (e.g., using a low-impedance gate driver). Also, consider using a gate-source voltage (Vgs) of around 4-5V to reduce switching losses.
  • For optimal thermal performance, use a multi-layer PCB with a solid ground plane and thermal vias under the device. Ensure good thermal conductivity between the device and the heat sink or thermal interface material. Consult the onsemi application note AND8199/D for more information on thermal management.
  • Use a suitable overvoltage protection (OVP) circuit, such as a zener diode or a dedicated OVP IC, to clamp the voltage to a safe level. For overcurrent protection, consider using a current sense resistor and a comparator or a dedicated overcurrent protection IC.
  • Consult the onsemi application note AND8199/D for recommended gate drive and protection circuits, including examples of gate driver ICs and protection components. You can also refer to the onsemi MOSFET driver ICs, such as the NCP5106, for a complete solution.

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