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NIS5232MN1TXG - onsemi

Description: Electronic Fuse Regulator High-Side 4.2A 10-DFN (3x3)

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Symbol
NIS5232MN1TXG - onsemi - PCB symbol
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PCB Footprints
NIS5232MN1TXG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN10, 3x3, 0.5P CASE 485C ISSUE F
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3D Models
NIS5232MN1TXG - onsemi - 3D model - Small Outline No-lead - DFN10, 3x3, 0.5P CASE 485C ISSUE F
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NIS5232MN1TXG Details

  • Manufacturer Part Number:

    NIS5232MN1TXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DFN10, 3x3, 0.5P

  • Pin Count:

    10

  • Manufacturer Package Code:

    485C

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    eFUSE

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    9 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NIS5232MN1TXG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider using a thermal monitoring system to prevent overheating.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the NIS5232MN1TXG is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended design and manufacturing guidelines to ensure the device meets the required reliability standards.
  • Use a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. Ensure that the device is not exposed to temperatures above 260°C (500°F) for an extended period.

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NIS5232MN1TXG Overview

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