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NIS6432MT2TWG - onsemi

Description: Fast Response Overvoltage Clamp Circuit; Digital and Tristate Enable; 42 mΩ Typical; Integrated Reverse Current Protection; Thermally Protected; Integrated Soft−Start Circuit; Internal Undervoltage Lockout Circuit

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NIS6432MT2TWG - onsemi PCB footprint - Other - Other - NIS6432MT2TWG-3
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NIS6432MT2TWG - onsemi  - 3D model - Other - NIS6432MT2TWG-3
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NIS6432MT2TWG Details

  • Manufacturer Part Number:

    NIS6432MT2TWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WQFN-12

  • Package Description:

    WQFN-12

  • Manufacturer Package Code:

    510BM

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    eFUSE

  • JESD-30 Code:

    R-XQCC-N12

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC12,.08X.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NIS6432MT2TWG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and use a thermal interface material (TIM) with a high thermal conductivity. Additionally, consider using a device with a higher temperature rating or implementing thermal monitoring and shutdown mechanisms.
  • The NIS6432MT2TWG has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding straps, and ionizers to minimize the risk of ESD damage.
  • Yes, the NIS6432MT2TWG is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and to ensure that the device is properly qualified and validated for the specific application. Additionally, consider using devices with a higher temperature rating and implementing redundant or fail-safe mechanisms.
  • To troubleshoot issues related to the internal voltage regulator, start by checking the input voltage, output voltage, and current consumption. Verify that the input voltage is within the recommended range, and that the output voltage is stable and within the specified tolerance. Also, check for any signs of overheating, and ensure that the device is properly soldered and connected.

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NIS6432MT2TWG Overview

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