NJVMJD122T4G-VF01 footprint, schematic symbol and 3D model by onsemi

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NJVMJD122T4G-VF01 - onsemi PCB footprint - Other - Other - NJVMJD122T4G-VF01-1

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Part Number NJVMJD122T4G-VF01
Manufacturer onsemi
Pin Count 3
Part Category Transistor BJT NPN
Package Category Other
Footprint Name Other - NJVMJD122T4G-VF01-1
Released Date Oct 28, 2019
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

NJVMJD122T4G-VF01 Details

Manufacturer Part Number:
NJVMJD122T4G-VF01
Brand Name:
ON Semiconductor
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Manufacturer Package Code:
369C
Country Of Origin:
Vietnam
ECCN Code:
EAR99
Date Of Intro:
2017-01-31
Manufacturer:
onsemi
YTEOL:
0
Case Connection:
COLLECTOR
Collector Current-Max (IC):
8 A
Collector-Emitter Voltage-Max:
100 V
Configuration:
DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
DC Current Gain-Min (hFE):
100
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-65 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Reference Standard:
AEC-Q101
Surface Mount:
YES
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
AMPLIFIER
Transistor Element Material:
SILICON

NJVMJD122T4G-VF01 Frequently Asked Questions (FAQs)

A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
Handle the device with an anti-static wrist strap or mat. Use ESD-sensitive handling procedures, and ensure the device is stored in an anti-static bag or container.
Yes, but ensure you follow the recommended design and qualification guidelines for high-reliability or automotive applications. Consult onsemi's application notes and reliability reports for more information.
Use a thermal imaging camera to identify hotspots, and check for proper PCB layout, thermal management, and power handling. Consult onsemi's application notes and technical support resources for troubleshooting guidance.

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