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NL17SZ08DFT2G - onsemi

Description: Tiny SOT-353 and SOT-553 Packages; 2.7 ns TPD at 5 Volts (typ); Source/Sink 24 mA at 3.0 Volts; Over-voltage tolerant Inputs; Pin For Pin with NC7SZ08P5X, TC7SZ08FU and TC7SZ08AFE; Chip Complexity: FETs = 20; Designed for 1.65 V to 5.5 V VCC operation; Pb-Free Packages are Available; Wide Operating Vcc Range

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PCB Footprints
NL17SZ08DFT2G - onsemi PCB footprint - Other - Other - NL17SZ08DFT2G-1
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NL17SZ08DFT2G - onsemi  - 3D model - Other - NL17SZ08DFT2G-1
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NL17SZ08DFT2G Details

  • Manufacturer Part Number:

    NL17SZ08DFT2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88A (SC-70-5 / SOT-353)

  • Package Description:

    SC-88A, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    419A-02

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    AND GATE

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    5.5 ns

  • Propagation Delay (tpd):

    12.7 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

NL17SZ08DFT2G Frequently Asked Questions (FAQs)

  • A good PCB layout for NL17SZ08DFT2G involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper power and decoupling, use a 1.8V power supply with a minimum of 10uF decoupling capacitor (X5R or X7R type) placed as close as possible to the device. Add additional 100nF and 10nF capacitors in parallel to filter out high-frequency noise.
  • The NL17SZ08DFT2G can operate up to 200 MHz, but the maximum frequency of operation depends on the specific application and PCB layout. It's recommended to consult the datasheet and application notes for specific guidance.
  • To manage thermal issues, ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to operate at high temperatures or high frequencies. The maximum junction temperature is 150°C.
  • The NL17SZ08DFT2G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is powered up and down slowly, and avoid voltage spikes or transients on the power supply lines.

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NL17SZ08DFT2G Overview

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