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V62/04733-02XE - Texas Instruments

Description: Logic Gates Mil Enhance Sgl 2- Input Pos-AND Gate

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V62/04733-02XE - Texas Instruments - PCB symbol
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PCB Footprints
V62/04733-02XE - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK (R-PDSO-G5)
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V62/04733-02XE - Texas Instruments - 3D model - SOT23 (5-Pin) - DCK (R-PDSO-G5)
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V62/04733-02XE Details

  • Manufacturer Part Number:

    V62/04733-02XE

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    5

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    AND GATE

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    6.5 ns

  • Propagation Delay (tpd):

    11 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

V62/04733-02XE Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management guide in their application notes (SLVAE03) and layout files (V62_04733_02XE_layout.zip). It's essential to follow these guidelines to ensure optimal performance, reduce thermal resistance, and prevent overheating.
  • The selection of input and output capacitors depends on the specific application, output voltage, and ripple current requirements. TI recommends using low-ESR capacitors with a minimum capacitance of 10uF for the input and 22uF for the output. Refer to the datasheet and application notes for more detailed guidance.
  • The maximum ambient temperature for reliable operation is 85°C. As the ambient temperature increases, the device's performance may degrade, and the output voltage may drop. It's essential to ensure proper thermal management and consider derating the device's performance at higher temperatures.
  • TI recommends using external OVP and UVP circuits to protect the device from voltage transients and faults. The application notes provide examples of OVP and UVP circuits that can be implemented using external components.
  • The recommended startup sequence is to apply the input voltage (VIN) before enabling the device (EN pin). The startup timing depends on the specific application, but a typical sequence is to apply VIN, wait for 10ms, and then enable the device. Refer to the datasheet and application notes for more detailed guidance.

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V62/04733-02XE Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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