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NSBC114EDP6T5G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

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NSBC114EDP6T5G - onsemi PCB footprint - Other - Other - NSBC114EDP6T5G-4
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NSBC114EDP6T5G - onsemi  - 3D model - Other - NSBC114EDP6T5G-4
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NSBC114EDP6T5G Details

  • Manufacturer Part Number:

    NSBC114EDP6T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-963 1x1, 0.35P

  • Pin Count:

    6

  • Manufacturer Package Code:

    527AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    BUILT IN BIAS RESISTOR RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    35

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.408 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NSBC114EDP6T5G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane, placing thermal vias under the device, and using a thermal pad on the bottom of the package. Additionally, keeping the PCB traces away from the device and using a heat sink can help to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a heat sink, and implement thermal management techniques such as airflow or convection cooling. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The NSBC114EDP6T5G has built-in ESD protection, but it's still important to follow proper handling and storage precautions to prevent damage. Use an anti-static wrist strap, mat, or packaging, and avoid touching the device's pins or exposed die. Also, ensure that the device is stored in a dry, cool place, away from direct sunlight.
  • Yes, the NSBC114EDP6T5G is suitable for high-reliability and automotive applications. It's AEC-Q100 qualified and meets the requirements for automotive-grade devices. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly validated and tested for the specific application.
  • The recommended soldering and assembly techniques for the NSBC114EDP6T5G include using a soldering iron with a temperature range of 250°C to 260°C, and a soldering time of 3-5 seconds. Additionally, use a solder with a melting point above 217°C, and ensure that the device is properly aligned and seated during assembly.

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NSBC114EDP6T5G Overview

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