Description:Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant
HALOGEN FREE AND ROHS COMPLIANT, CASE 524AA-01, 3 PIN
Pin Count:
3
Manufacturer Package Code:
524AA
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Manufacturer:
onsemi
YTEOL:
7
Additional Feature:
BUILT IN BIAS RESISTOR RATIO IS 1
Collector Current-Max (IC):
0.1 A
Collector-Emitter Voltage-Max:
50 V
Configuration:
SINGLE WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE):
35
JESD-30 Code:
R-PDSO-F3
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Power Dissipation-Max (Abs):
0.297 W
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
FLAT
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
NSBC114EF3T5G Frequently Asked Questions (FAQs)
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
The critical timing parameters include the input rise and fall times, propagation delay, and output enable/disable times. These parameters are critical for ensuring reliable data transmission and reception.
Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the device from electrostatic discharge. Also, ensure that the PCB is designed with ESD protection in mind, including the use of ESD-safe materials and handling procedures.
The recommended power sequencing is to power up the device in the following order: VCC, then VDD, and finally the input signals. The voltage ramp-up procedure should be slow and controlled to prevent damage to the device.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NSBC114EF3T5G Overview
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