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NSBC114TF3T5G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
NSBC114TF3T5G - onsemi PCB footprint - Other - Other - NSBA113EF3T5G-1
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3D Models
NSBC114TF3T5G - onsemi  - 3D model - Other - NSBA113EF3T5G-1
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NSBC114TF3T5G Details

  • Manufacturer Part Number:

    NSBC114TF3T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-1123, 1.0x0.6x0.37, 0.35P

  • Pin Count:

    3

  • Manufacturer Package Code:

    524AA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    BUILT IN BIAS RESISTOR

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    160

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.297 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NSBC114TF3T5G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would involve placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and connect it to a thermal plane or a heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider derating the device's power dissipation. Additionally, ensure that the PCB and surrounding components are rated for the expected operating temperature range.
  • The NSBC114TF3T5G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.
  • The NSBC114TF3T5G is a commercial-grade device, but onsemi offers other versions of the device that are specifically designed for high-reliability or automotive applications. These devices typically have additional testing and qualification, and may have different part numbers or suffixes. Consult with onsemi or a qualified distributor for more information.
  • To troubleshoot issues with the device, start by reviewing the datasheet and application notes to ensure that the device is being used within its recommended operating conditions. Then, use a systematic approach to isolate the issue, such as checking the power supply, signal integrity, and PCB layout. Consider using debugging tools, such as oscilloscopes or logic analyzers, to help identify the root cause of the issue.

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NSBC114TF3T5G Overview

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