HALOGEN FREE AND ROHS COMPLIANT, CASE 318F, SC-74, 6 PIN
Pin Count:
6
Manufacturer Package Code:
318F-05
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
9 Weeks
Manufacturer:
onsemi
YTEOL:
7
Collector Current-Max (IC):
0.6 A
Collector-Emitter Voltage-Max:
40 V
Configuration:
SINGLE WITH BUILT-IN DIODE
DC Current Gain-Min (hFE):
40
JESD-30 Code:
R-PDSO-G6
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
6
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
250 MHz
Turn-off Time-Max (toff):
255 ns
Turn-on Time-Max (ton):
35 ns
NSM6056MT1G Frequently Asked Questions (FAQs)
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. The datasheet provides a recommended land pattern, but a more detailed layout guide can be found in the onsemi application note AND9093/D.
To ensure reliable operation at high temperatures, it's essential to follow the recommended derating guidelines for the device. The datasheet provides a thermal derating curve, and the application note AND9093/D provides additional guidance on thermal management.
The NSM6056MT1G has internal ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. The device can withstand a human body model (HBM) of 2 kV and a charged device model (CDM) of 1 kV.
Yes, the NSM6056MT1G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, it's essential to consult with onsemi's quality and reliability team to ensure the device meets the specific requirements of your application.
The recommended soldering conditions for the NSM6056MT1G are a peak temperature of 260°C, a dwell time of 10-30 seconds, and a soldering process that meets the requirements of IPC/J-STD-020. It's essential to follow these guidelines to prevent damage to the device.
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NSM6056MT1G Overview
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