HALOGEN FREE AND ROHS COMPLIANT, CASE 318F, SC-74, 6 PIN
Pin Count:
6
Manufacturer Package Code:
318F-05
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
10 Weeks
Manufacturer:
onsemi
YTEOL:
7
Collector Current-Max (IC):
0.5 A
Collector-Emitter Voltage-Max:
80 V
Configuration:
SINGLE WITH BUILT-IN DIODE
DC Current Gain-Min (hFE):
120
JESD-30 Code:
R-PDSO-G6
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
6
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Power Dissipation-Max (Abs):
0.4 W
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
150 MHz
NSM80101MT1G Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal conductivity between the device and the heat sink. Additionally, consider using thermal interface materials and following proper PCB design guidelines for thermal management.
Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
To handle ESD protection for the NSM80101MT1G, follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the design. Additionally, consider using ESD protection devices, such as TVS diodes, to protect the device from electrostatic discharge.
The recommended soldering conditions for the NSM80101MT1G involve using a soldering temperature between 240°C to 260°C, with a peak temperature not exceeding 260°C. The soldering time should be limited to 10 seconds or less, and the device should be handled with care to avoid mechanical stress.
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NSM80101MT1G Overview
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