Description:These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable
HALOGEN FREE AND ROHS COMPLIANT, MINIATURE, CASE 318-08, 3 PIN
Pin Count:
3
Manufacturer Package Code:
318
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
10 Weeks
Manufacturer:
onsemi
YTEOL:
7
Collector Current-Max (IC):
2 A
Collector-Emitter Voltage-Max:
100 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
40
JEDEC-95 Code:
TO-236
JESD-30 Code:
R-PDSO-G3
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Power Dissipation-Max (Abs):
0.71 W
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
110 MHz
NSS1C201LT1G Frequently Asked Questions (FAQs)
A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, thermal vias can be used to further improve heat dissipation.
Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
Yes, the NSS1C201LT1G is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards (e.g., AEC-Q101). Consult with onsemi's application engineers for guidance.
Consult the datasheet and application notes for troubleshooting guidelines. Check for proper PCB layout, thermal management, and power supply decoupling. Use oscilloscopes and other diagnostic tools to identify issues. If problems persist, contact onsemi's technical support for assistance.
Trust Checks
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Manufacturer Collaborated
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System Verified
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Community Approved
Sponsored
NSS1C201LT1G Overview
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