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NSS20101JT1G - onsemi

Description: These Devices are Pb-Free and are RoHS Compliant; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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NSS20101JT1G - onsemi - PCB symbol
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PCB Footprints
NSS20101JT1G - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SC-89 CASE 463C-03 ISSUE C
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3D Models
NSS20101JT1G - onsemi - 3D model - SO Transistor Flat Lead - SC-89 CASE 463C-03 ISSUE C
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NSS20101JT1G Details

  • Manufacturer Part Number:

    NSS20101JT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-89, 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    463C-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    1 A

  • Collector-Emitter Voltage-Max:

    20 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    100

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    350 MHz

NSS20101JT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power dissipation at high temperatures.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage below 5V.
  • Yes, but ensure the device is properly sealed or conformally coated to prevent moisture ingress. Also, follow the recommended storage and handling procedures to prevent moisture absorption.
  • Check the input voltage, output load, and PCB layout. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Use an oscilloscope to measure the output voltage and check for any oscillations or noise.

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NSS20101JT1G Overview

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