NSS35200MR6T1G footprint, schematic symbol and 3D model by onsemi

Symbol

click to zoom

PCB Footprints

click to zoom

Datasheet Download Datasheet
Stock & Prices Price & Stock for NSS35200MR6T1G
Part Number NSS35200MR6T1G
Manufacturer onsemi
Pin Count 6
Part Category Transistor BJT PNP
Package Category Small Outline Packages
Footprint Name Small Outline Packages - TSOP-6 CASE318G-02
Released Date Aug 31, 2018
Last Modified Date Jan 22, 2025 4:53 PM UTC
Pinout / Pin List Click Here (Member Only)

NSS35200MR6T1G Details

Manufacturer Part Number:
NSS35200MR6T1G
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
TSOP-6
Package Description:
TSOP-6
Pin Count:
6
Manufacturer Package Code:
318G-02
Country Of Origin:
Malaysia
ECCN Code:
EAR99
Manufacturer:
onsemi
YTEOL:
0
Collector Current-Max (IC):
2 A
Collector-Emitter Voltage-Max:
35 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
100
JESD-30 Code:
R-PDSO-G6
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
6
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
PNP
Power Dissipation-Max (Abs):
1.75 W
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
100 MHz

NSS35200MR6T1G Frequently Asked Questions (FAQs)

A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal management techniques such as heat sinks or thermal interfaces.
Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the device operates within the recommended temperature range.
Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the device from electrostatic discharge. Follow proper PCB design and handling practices to minimize ESD risks.
Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s, and time above 240°C 30s. For rework, use a low-temperature soldering iron and avoid applying excessive heat or force to the device.

Trust Checks

Manufacturer Collaborated

System Verified

Community Approved

NSS35200MR6T1G Overview

Use the download button to access the NSS35200MR6T1G schematic symbol and PCB footprint.

To find more CAD model downloads similar to this part, try a partial part number search, like NSS35, or try a keyword search, such as Small Signal Bipolar Transistors

Parts related to NSS35200MR6T1G

Showing 0 results