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NSS40301MDR2G - onsemi

Description: Current Gain Matching to 10%; Base Emitter Voltage Matched to 2 mV; This is a Pb-Free Device; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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NSS40301MDR2G - onsemi - PCB symbol
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PCB Footprints
NSS40301MDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07
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3D Models
NSS40301MDR2G - onsemi - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07
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NSS40301MDR2G Details

  • Manufacturer Part Number:

    NSS40301MDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    3 A

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    180

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.783 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

  • Turn-off Time-Max (toff):

    890 ns

  • Turn-on Time-Max (ton):

    200 ns

NSS40301MDR2G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the device is not exposed to thermal shocks or rapid temperature changes.
  • A 10uF to 22uF ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and use a common-mode choke or ferrite bead on the input lines to reduce EMI. Also, ensure that the PCB layout is optimized for minimal radiation.
  • A 10uF to 22uF ceramic capacitor is recommended for output filtering. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.

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NSS40301MDR2G Overview

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