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NSV40200LT1G - onsemi

Description: High Current, Low VCEsat, ESD Robust, High Current Gain, High Cut Off Frequency, Low Profile Package, Linear Gain (Beta); NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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Symbol
NSV40200LT1G - onsemi - PCB symbol
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PCB Footprints
NSV40200LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR_1
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3D Models
NSV40200LT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR_1
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NSV40200LT1G Details

  • Manufacturer Part Number:

    NSV40200LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Collector Current-Max (IC):

    2 A

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    150

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.71 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transition Frequency-Nom (fT):

    100 MHz

NSV40200LT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system. A heat sink or thermal interface material may be necessary for high-power applications.
  • A ceramic capacitor with a value of 1-10uF and a voltage rating of 50V or higher is recommended. The capacitor should be placed as close to the VIN pin as possible to minimize inductance.
  • Use a TVS diode or a zener diode to clamp the input voltage to a safe level. Additionally, consider adding a fuse or a PTC resettable fuse to protect against overcurrent conditions. A current sense resistor can also be used to monitor the current and trigger a shutdown or alarm in case of an overcurrent event.
  • A ceramic capacitor with a value of 1-10uF and a voltage rating of 50V or higher is recommended. The capacitor should be placed as close to the VOUT pin as possible to minimize inductance. A larger capacitor value may be required for high-current applications.

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NSV40200LT1G Overview

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