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NSV60201LT1G - onsemi

Description: High Current, Low VCEsat, ESD Robust, High Current Gain, High Cut Off Frequency, Low Profile Package, Linear Gain (Beta); NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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PCB Footprints
NSV60201LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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3D Models
NSV60201LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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NSV60201LT1G Details

  • Manufacturer Part Number:

    NSV60201LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    TO-236, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    2 A

  • Collector-Emitter Voltage-Max:

    60 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    100

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

  • Turn-off Time-Max (toff):

    1220 ns

  • Turn-on Time-Max (ton):

    155 ns

NSV60201LT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the IC, using a solid ground plane, and keeping the thermal path short and direct to the heat sink or thermal pad.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a heat sink or thermal pad, and consider derating the device's power dissipation according to the temperature derating curve.
  • The NSV60201LT1G has built-in ESD protection diodes, but additional external protection measures such as TVS diodes or ESD arrays may be necessary depending on the application. Latch-up prevention can be achieved by following proper PCB design and layout guidelines, and using a latch-up immune design approach.
  • Yes, the NSV60201LT1G can be used in switching regulator applications, but it's essential to ensure that the device is operated within its recommended switching frequency range and that the layout is designed to minimize electromagnetic interference (EMI).
  • To troubleshoot issues related to output voltage regulation, check the input voltage, output voltage, and feedback resistors. Verify that the feedback network is properly connected and that the output voltage is within the specified range. Also, ensure that the device is operated within its recommended operating conditions.

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NSV60201LT1G Overview

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