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NSVDTC144EM3T5G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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NSVDTC144EM3T5G Details

  • Manufacturer Part Number:

    NSVDTC144EM3T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-723-3

  • Manufacturer Package Code:

    631AA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    BUILIT-IN BIAS RESISTOR

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.6 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • VCEsat-Max:

    0.25 V

NSVDTC144EM3T5G Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves placing the device near the edge of the board, using a solid ground plane, and minimizing thermal resistance. A thermal pad on the bottom of the package should be connected to a thermal vias array to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider derating the device's power handling capabilities. Additionally, using a thermally conductive material, such as a heat sink or thermal interface material, can help to dissipate heat.
  • The NSVDTC144EM3T5G has built-in ESD protection, but it's still essential to follow proper handling and storage precautions to prevent damage. This includes using an ESD wrist strap, anti-static bags, and workbenches, as well as avoiding touching the device's pins or exposed die.
  • Yes, the NSVDTC144EM3T5G is suitable for high-reliability and automotive applications due to its AEC-Q101 qualification. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly validated and tested for the specific application.
  • The recommended soldering technique for the NSVDTC144EM3T5G is reflow soldering, with a peak temperature of 260°C. It's essential to follow the recommended soldering profile, and ensure that the device is properly aligned and secured during the assembly process.

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NSVDTC144EM3T5G Overview

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