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NSVMMBT5401LT3G - onsemi

Description: These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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NSVMMBT5401LT3G - onsemi - PCB symbol
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PCB Footprints
NSVMMBT5401LT3G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23 (TO−236) 2.90x1.30x1.00 1.90P CASE 318 ISSUE AU_2024
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3D Models
NSVMMBT5401LT3G - onsemi - 3D model - SOT23 (3-Pin) - SOT−23 (TO−236) 2.90x1.30x1.00 1.90P CASE 318 ISSUE AU_2024
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NSVMMBT5401LT3G Details

  • Manufacturer Part Number:

    NSVMMBT5401LT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

  • Package Description:

    TO-236, 3 PIN

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.5 A

  • Collector-Emitter Voltage-Max:

    150 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    50

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

NSVMMBT5401LT3G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to the onsemi application note AND9173/D for more details.
  • Ensure the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • Follow the onsemi ESD protection guidelines, which include using ESD-sensitive device handling procedures, implementing ESD protection circuits, and using ESD-protected workstations.
  • Yes, the NSVMMBT5401LT3G is qualified for automotive and high-reliability applications. However, ensure you follow the onsemi automotive qualification guidelines and relevant industry standards, such as AEC-Q101.
  • Store the devices in their original packaging, away from direct sunlight and moisture. Handle the devices by the body, avoiding touching the leads or die. Follow the onsemi storage and handling guidelines to prevent damage and ensure reliability.

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NSVMMBT5401LT3G Overview

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