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NSVMMBT6429LT1G - onsemi

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PCB Footprints
NSVMMBT6429LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE- 318-08 ISSUE AR_1
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3D Models
NSVMMBT6429LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE- 318-08 ISSUE AR_1
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NSVMMBT6429LT1G Details

  • Manufacturer Part Number:

    NSVMMBT6429LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Collector Current-Max (IC):

    0.2 A

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    500

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transition Frequency-Nom (fT):

    100 MHz

NSVMMBT6429LT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal management, use a heat sink or thermal pad, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The NSVMMBT6429LT1G has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and use ESD-protective packaging. For latch-up prevention, ensure that the device is operated within the recommended voltage and current ranges.
  • Yes, the NSVMMBT6429LT1G is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly validated and qualified for the specific application.
  • Follow the recommended soldering temperature profile, and use a solder with a melting point above 217°C. Ensure that the device is handled and assembled in a clean, ESD-protected environment.

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NSVMMBT6429LT1G Overview

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