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NT6AN1024F32AV-J2 - Nanya

Description: Basis LPDDR4 Compliant - Low Power Consumption - 16n Prefetch Architecture and BL16, BL32 (OTF) Signal Integrity - Internal VREF and VREF Training - Configurable DS for system compatibility - Configurable On-Die Termination - ZQ Calibration for DS/ODT impedance accuracy via external ZQ pad (240Ω± 1%) - Data bus inversion (DBI) Training for Signals’ Synchronization - DQ Calibration offering specific DQ output patterns

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PCB Footprints
NT6AN1024F32AV-J2 - Nanya PCB footprint - BGA - BGA - 200-Ball FBGA
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NT6AN1024F32AV-J2 Details

  • Manufacturer Part Number:

    NT6AN1024F32AV-J2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-200

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    Nanya Technology Corporation

  • YTEOL:

    5

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMIMAL SUPPLY VOLTAGE; TERM PITCH-MAX

  • Clock Frequency-Max (fCLK):

    1866 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    16,32

  • JESD-30 Code:

    R-PBGA-B200

  • Length:

    15 mm

  • Memory Density:

    34359738368 bit

  • Memory IC Type:

    LPDDR4 DRAM

  • Memory Width:

    32

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    200

  • Number of Words:

    1073741824 words

  • Number of Words Code:

    1000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -30 °C

  • Organization:

    1GX32

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA200,12X22,32/25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    16,32

  • Standby Current-Max:

    0.12 A

  • Supply Current-Max:

    0.7 mA

  • Supply Voltage-Max (Vsup):

    1.17 V

  • Supply Voltage-Min (Vsup):

    1.06 V

  • Supply Voltage-Nom (Vsup):

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    10 mm

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