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NTBL095N65S3H - onsemi

Description: 700 V @ TJ = 150°C; Leadless Ultra-thin SMD package; Kelvin Source Configuration; Fast switching performance with robust body diode; Ultra Low Gate Charge (Typ. Qg = 58 nC); Low Effective Output Capacitance (Typ. Coss(eff.) = 522 pF); Moisture Sensitivity Level 1 guarantee; Typ. RDS(on) = 77 m Ω; 100% Avalanche Tested; RoHS Compliant

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NTBL095N65S3H Details

  • Manufacturer Part Number:

    NTBL095N65S3H

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    H-PSOF8L 9.90x10.38x2.30, 1.20P

  • Package Description:

    H-PSOF8L, 8 PIN

  • Manufacturer Package Code:

    100DC

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Avalanche Energy Rating (Eas):

    284 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    650 V

  • Drain Current-Max (ID):

    30 A

  • Drain-source On Resistance-Max:

    0.095 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    208 W

  • Pulsed Drain Current-Max (IDM):

    84 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTBL095N65S3H Frequently Asked Questions (FAQs)

  • The SOA is not explicitly stated in the datasheet. However, you can use the provided thermal impedance and power dissipation curves to determine the safe operating area for your specific application.
  • The datasheet provides the junction-to-ambient thermal resistance (RθJA). To calculate RθJC, you can use the following formula: RθJC = RθJA - (ψJT * RθCS), where ψJT is the junction-to-case thermal resistance coefficient, and RθCS is the case-to-sink thermal resistance.
  • The datasheet recommends a gate drive voltage, but a general rule of thumb is to drive the gate with a voltage at least 2-3 times the threshold voltage (Vth) to ensure proper switching. For the NTBL095N65S3H, Vth is around 2.5V, so a gate drive voltage of 5-7.5V would be suitable.
  • While the NTBL095N65S3H is a high-power MOSFET, it's essential to carefully evaluate the device's thermal performance, switching characteristics, and parasitic components (e.g., gate-source capacitance) to ensure it meets your specific application requirements.
  • The internal gate resistance (Rg) is not explicitly stated in the datasheet. However, you can estimate Rg using the gate-source capacitance (Cgs) and the gate-drain capacitance (Cgd). A general rule of thumb is to assume Rg ≈ 1-2 ohms.

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