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NTCS0805E3103GMT - Vishay

Description: VISHAY - NTCS0805E3103GMT - NTC SMD 0805 NiSn 10K 2% medium B T&R e3

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NTCS0805E3103GMT - Vishay - PCB symbol
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PCB Footprints
NTCS0805E3103GMT - Vishay PCB footprint - Thermistors Chip - Thermistors Chip - NTCS0805
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NTCS0805E3103GMT - Vishay - 3D model - Thermistors Chip - NTCS0805
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NTCS0805E3103GMT Details

  • Manufacturer Part Number:

    NTCS0805E3103GMT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8.8

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER

  • Rated Power Dissipation (P):

    0.21 W

  • Rated Temperature:

    25 °C

  • Reference Standard:

    AEC-Q200; CUL; UL

  • Resistance:

    10000 Ω

  • Resistor Type:

    NTC THERMISTOR

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Thermal Sensitivity Index:

    3570 K

  • Thermistor Application:

    TEMPERATURE SENSING

  • Tolerance:

    2%

NTCS0805E3103GMT Frequently Asked Questions (FAQs)

  • The recommended land pattern for the NTCS0805E3103GMT is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
  • The NTCS0805E3103GMT has a thermal resistance of 350°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
  • The recommended soldering profile for the NTCS0805E3103GMT is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. Avoid exceeding 280°C to prevent damage to the component.
  • Yes, the NTCS0805E3103GMT is designed to withstand high-vibration environments. However, ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method.
  • Store the NTCS0805E3103GMT in a dry, cool place, away from direct sunlight. Use airtight packaging or a desiccant to maintain a relative humidity of 50% or less.

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NTCS0805E3103GMT Overview

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