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NTD3055L104-1G - onsemi

Description: Obsolete - Single N-Channel Logic Level Power MOSFET 60V, 12A, 104mΩ

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NTD3055L104-1G - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IPAK CASE 369D ISSUE C
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NTD3055L104-1G - onsemi  - 3D model - Transistor Outline, Vertical - IPAK CASE 369D ISSUE C
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NTD3055L104-1G Details

  • Manufacturer Part Number:

    NTD3055L104-1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK INSERTION MOUNT

  • Pin Count:

    4

  • Manufacturer Package Code:

    369

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    61 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    12 A

  • Drain-source On Resistance-Max:

    0.104 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    48 W

  • Pulsed Drain Current-Max (IDM):

    45 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTD3055L104-1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for NTD3055L104-1G is a 5x5mm QFN package with a 0.5mm pitch. The datasheet provides a recommended land pattern and solder mask design guidelines.
  • To ensure reliable operation of NTD3055L104-1G in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal vias, and ensuring good airflow around the device.
  • The maximum allowed voltage on the input pins of NTD3055L104-1G is 5.5V, which is the absolute maximum rating. Operating the device beyond this voltage can cause permanent damage.
  • Yes, NTD3055L104-1G can be used in a switching regulator application, but it is essential to ensure that the device is properly biased and that the switching frequency is within the recommended range to avoid oscillations and ensure stable operation.
  • To troubleshoot issues with NTD3055L104-1G, it is recommended to follow a systematic approach, including checking the power supply, input voltage, and output current, as well as verifying the device's thermal and electrical characteristics.

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NTD3055L104-1G Overview

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