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NTGD4167CT1G - onsemi

Description: Small Size (3 x 3 mm) Dual TSOP-6 Package; Reduced Gate Charge to Improve Switching Response; Idependently Connected Devices to Provides Design Flexibility; Complementary N−Channel and P−Channel MOSFET; Leading Edge Trench Technology for Low On Resistance

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PCB Footprints
NTGD4167CT1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP-6 CASE318G-02
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3D Models
NTGD4167CT1G - onsemi  - 3D model - SOT23 (6-Pin) - TSOP-6 CASE318G-02
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NTGD4167CT1G Details

  • Manufacturer Part Number:

    NTGD4167CT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-6

  • Package Description:

    TSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    318G-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    2.6 A

  • Drain-source On Resistance-Max:

    0.09 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.9 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTGD4167CT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage and current ratings. For NTGD4167CT1G, the maximum voltage is 100V and the maximum current is 4A. Operating within these limits ensures safe operation.
  • Use ESD-sensitive handling procedures, such as grounding wrist straps and using ESD-protective packaging. Also, ensure that the device is properly connected to a ground plane during PCB assembly.
  • Use a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 3-5 seconds. Ensure that the device is not exposed to temperatures above 260°C for more than 10 seconds.

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NTGD4167CT1G Overview

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