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NTGS3136PT1G - onsemi

Description: Low RDS(on) in TSOP-6 Package; 1.8 V Gate Rating; Fast Switching; RoHS Compliant

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Symbol
NTGS3136PT1G - onsemi - PCB symbol
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PCB Footprints
NTGS3136PT1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP-6 CASE318G-02 ISSUE V
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3D Models
NTGS3136PT1G - onsemi - 3D model - SOT23 (6-Pin) - TSOP-6 CASE318G-02 ISSUE V
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NTGS3136PT1G Details

  • Manufacturer Part Number:

    NTGS3136PT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-6

  • Package Description:

    TSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    318G-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    5.8 A

  • Drain-source On Resistance-Max:

    0.033 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTGS3136PT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The NTGS3136PT1G has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and use. For latch-up prevention, ensure that the device is not exposed to excessive voltage or current, and use a latch-up immune design.
  • Yes, the NTGS3136PT1G is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly validated and qualified for the specific application.
  • Follow the recommended soldering temperature profile, and use a no-clean or water-soluble flux. Ensure that the device is handled and stored properly to prevent damage.

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NTGS3136PT1G Overview

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