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NTJD1155LT2G - onsemi

Description: Extremely Low RDS(on) P-Channel Load Switch MOSFET; Level Shift MOSFET is ESD Protected; Low Profile, Small Footprint Package; VIN Range 1.8 to 8.0 V; ON/OFF Range 1.5 to 8.0 V

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PCB Footprints
NTJD1155LT2G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC−88/SC70−6/SOT−363_1
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3D Models
NTJD1155LT2G - onsemi  - 3D model - SOT23 (6-Pin) - SC−88/SC70−6/SOT−363_1
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NTJD1155LT2G Details

  • Manufacturer Part Number:

    NTJD1155LT2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88-6 / SC-70-6 / SOT-363-6

  • Manufacturer Package Code:

    419B-02

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2019-05-17

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Configuration:

    COMPLEX

  • DS Breakdown Voltage-Min:

    8 V

  • Drain Current-Max (ID):

    1.3 A

  • Drain-source On Resistance-Max:

    0.175 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.4 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTJD1155LT2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. The datasheet provides a recommended land pattern, but a more detailed layout guide can be found in the onsemi application note AND9093/D.
  • The NTJD1155LT2G requires a bias voltage of 2.5V to 5.5V on the VCC pin, and a bias current of 1mA to 10mA on the IBIAS pin. A stable voltage regulator and a low-noise bias circuit are recommended to ensure optimal performance.
  • While the datasheet specifies a maximum operating frequency of 1.5 GHz, the actual frequency limit depends on the specific application and PCB layout. In general, the device can operate up to 2.5 GHz with proper layout and termination.
  • The NTJD1155LT2G has built-in ESD protection, but additional protection measures can be taken to prevent damage during handling and assembly. Use of ESD-safe handling procedures, wrist straps, and anti-static packaging can help prevent damage.
  • The device should be stored in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the device by the body, not the leads. Use of anti-static packaging and ESD-safe handling procedures is recommended.

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NTJD1155LT2G Overview

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