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NTLJF4156NT1G - onsemi

Description: WDFN Package Provides Exposed Drain Pad for Excellent Thermal Conduction; Co-Packaged MOSFET and Schottky For Easy Circuit Layout; RDS(on) Rated at Low VGS=1.5 V; Low Profile (< 0.8mm) for Easy Fit in Thin Environments; Low VF Schottky

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NTLJF4156NT1G - onsemi PCB footprint - Other - Other - NTLJF4156NT1G-1
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NTLJF4156NT1G Details

  • Manufacturer Part Number:

    NTLJF4156NT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN6 2x2, 0.65P

  • Package Description:

    WDFN6, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    506AN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.32

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    2.5 A

  • Drain-source On Resistance-Max:

    0.09 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    32 pF

  • JESD-30 Code:

    S-PDSO-C6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.21 W

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTLJF4156NT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • The device requires a stable voltage supply and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to set the desired voltage and current levels.
  • The device is sensitive to electrostatic discharge (ESD). Handling the device requires proper ESD protection, such as wearing an ESD strap, using an ESD mat, and storing the device in an ESD-safe environment.
  • Use a multimeter to measure voltage and current at different points in the circuit. Check for proper connections, soldering, and component values. Consult the datasheet and application notes for guidance on troubleshooting common issues.
  • onsemi follows industry-standard quality and reliability standards, such as AEC-Q100 and ISO/TS 16949, to ensure the device meets stringent requirements for automotive and industrial applications.

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NTLJF4156NT1G Overview

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