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NTLJS17D0P03P8ZTAG - onsemi

Description: Small Footprint, 4mm²; Ultra Low RDS(on); Pb-Free, Halogen-Free, and BFR-Free

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Symbol
NTLJS17D0P03P8ZTAG - onsemi - PCB symbol
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PCB Footprints
NTLJS17D0P03P8ZTAG - onsemi PCB footprint - Other - Other - WDFN6 2.05X2.05, 0.65P CASE 483AV ISSUE A
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3D Models
NTLJS17D0P03P8ZTAG - onsemi - 3D model - Other - WDFN6 2.05X2.05, 0.65P CASE 483AV ISSUE A
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NTLJS17D0P03P8ZTAG Details

  • Manufacturer Part Number:

    NTLJS17D0P03P8ZTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-6

  • Package Description:

    WDFN-6

  • Manufacturer Package Code:

    483AV

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.07

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    11.7 A

  • Drain-source On Resistance-Max:

    0.0113 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    530 pF

  • JESD-30 Code:

    S-PDSO-N4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2.4 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTLJS17D0P03P8ZTAG Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to the onsemi application note AND9173/D for more details.
  • The device requires a power-on reset (POR) circuit to ensure proper startup. A 10kΩ resistor and a 10nF capacitor can be used to create a POR circuit. Additionally, the EN pin should be tied to VIN through a 10kΩ resistor to ensure proper configuration.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the VIN pin to filter out noise and ensure stable operation.
  • The thermal shutdown feature is enabled by default. If the junction temperature exceeds 150°C, the device will shut down. To handle this, ensure proper thermal design, and consider adding a thermal warning signal to your design to take preventative measures before shutdown occurs.
  • The EN pin should not exceed 6V to prevent damage to the device. A voltage limiter or a Zener diode can be used to protect the EN pin from overvoltage conditions.

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NTLJS17D0P03P8ZTAG Overview

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