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NTLJS2103PTBG - onsemi

Description: P-Channel 12 V 3.5A (Ta) 700mW (Ta) Surface Mount 6-WDFN (2x2), 40mOhm, 1157pF, -55°C ~ 150°C

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Symbol
NTLJS2103PTBG - onsemi - PCB symbol
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PCB Footprints
NTLJS2103PTBG - onsemi PCB footprint - Other - Other - WDFN6 2x2 CASE 506AP ISSUE B
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3D Models
NTLJS2103PTBG - onsemi - 3D model - Other - WDFN6 2x2 CASE 506AP ISSUE B
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NTLJS2103PTBG Details

  • Manufacturer Part Number:

    NTLJS2103PTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN6, 2 x 2 x 0.75 mm, 0.65 mm Pitch

  • Package Description:

    WDFN-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    506AP

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.07

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    12 V

  • Drain Current-Max (ID):

    5.9 A

  • Drain-source On Resistance-Max:

    0.04 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    3.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTLJS2103PTBG Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to reduce the junction temperature. Also, consider derating the device's power handling at high temperatures.
  • The NTLJS2103PTBG has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind.
  • Yes, the NTLJS2103PTBG is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards (e.g., AEC-Q100). Consult with onsemi's application engineers for guidance.
  • Consult the datasheet and application notes for troubleshooting guidelines. Use oscilloscopes and other diagnostic tools to identify issues. If problems persist, contact onsemi's technical support team for assistance.

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NTLJS2103PTBG Overview

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