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NTLJS3D0N02P8ZTAG - onsemi

Description: Ultra Low RDS(on); Small Footprint of 4mm²; Pb−Free, Halogen−Free/BFR−Free

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PCB Footprints
NTLJS3D0N02P8ZTAG - onsemi PCB footprint - Other - Other - WDFN6 2.05X2.05, 0.65P CASE 483AV ISSUEA
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3D Models
NTLJS3D0N02P8ZTAG - onsemi  - 3D model - Other - WDFN6 2.05X2.05, 0.65P CASE 483AV ISSUEA
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NTLJS3D0N02P8ZTAG Details

  • Manufacturer Part Number:

    NTLJS3D0N02P8ZTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    PQFN-6

  • Package Description:

    WDFN6, 3 PIN

  • Manufacturer Package Code:

    483AV

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    1

  • Additional Feature:

    ULTRA LOW RESISTANCE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    12.1 A

  • Drain-source On Resistance-Max:

    0.0055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-N3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.4 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTLJS3D0N02P8ZTAG Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the NTLJS3D0N02P8ZTAG is a standard SOT-223 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • To ensure proper thermal management, ensure a good thermal interface between the device and the heat sink, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and design the PCB to allow for good airflow around the device.
  • The maximum allowed voltage on the gate pin is ±20V, but it's recommended to keep it between -5V and +15V for reliable operation.
  • Use ESD protection devices, such as TVS diodes or ESD suppressors, on the PCB, and handle the device with ESD-safe materials and tools to prevent damage.
  • A recommended drive circuit includes a gate driver IC, such as the FAN5350, with a 10kΩ pull-down resistor on the gate pin and a 1kΩ pull-up resistor on the gate driver output.

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NTLJS3D0N02P8ZTAG Overview

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