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NTLJS4114NT1G - onsemi

Description: N-Channel 30 V 3.6A (Ta) 700mW (Ta) Surface Mount 6-WDFN (2x2)

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NTLJS4114NT1G - onsemi PCB footprint - Other - Other - WDFN6 2x2 CASE 506AP−01 ISSUE B_2024
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NTLJS4114NT1G - onsemi  - 3D model - Other - WDFN6 2x2 CASE 506AP−01 ISSUE B_2024
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NTLJS4114NT1G Details

  • Manufacturer Part Number:

    NTLJS4114NT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN6, 2 x 2 x 0.75 mm, 0.65 mm Pitch

  • Package Description:

    WDFN6, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    506AP

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    3.6 A

  • Drain-source On Resistance-Max:

    0.045 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-XDSO-C6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    3.3 W

  • Pulsed Drain Current-Max (IDM):

    28 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTLJS4114NT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The NTLJS4114NT1G has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and use ESD-protective packaging. For latch-up prevention, ensure that the device is not exposed to excessive voltage or current, and use a latch-up immune design.
  • Yes, the NTLJS4114NT1G is qualified for automotive and high-reliability applications. However, ensure that you follow the recommended operating conditions, and consider additional testing and validation for your specific application.
  • Use a systematic approach to troubleshoot, starting with checking the power supply, input signals, and output loads. Verify that the device is operated within the recommended conditions, and consider using a logic analyzer or oscilloscope to debug the issue.

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