SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
25 V
Drain Current-Max (ID):
74 A
Drain-source On Resistance-Max:
0.0033 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
22 pF
JESD-30 Code:
R-PDSO-N8
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
2
Number of Terminals:
8
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
25 W
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
NO LEAD
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
NTMFD1D4N02P1E Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance would involve placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and connect it to a thermal plane or a heat sink.
To ensure proper biasing, follow the recommended operating conditions in the datasheet. Make sure to provide a stable voltage supply, and use a suitable bias resistor to set the gate-source voltage. Additionally, ensure the device is operated within the recommended temperature range.
Operating the device beyond the recommended maximum junction temperature can lead to reduced performance, decreased lifespan, and potentially even device failure. It's essential to ensure the device is properly cooled and operated within the recommended temperature range to maintain reliability and performance.
To handle ESD protection, follow proper handling and storage procedures for the device. Use an ESD wrist strap or mat when handling the device, and ensure the PCB design includes ESD protection components such as TVS diodes or ESD protection arrays.
The recommended soldering conditions for the NTMFD1D4N02P1E involve using a soldering iron with a temperature of 260°C (500°F) for a maximum of 10 seconds. It's also recommended to use a solder with a melting point of 220°C (428°F) or higher.
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Manufacturer Collaborated
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System Verified
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NTMFD1D4N02P1E Overview
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