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NTMFSC006N12MC - onsemi

Description: Dual Cool™ Top Side Cooling PQFN package; Max rDS(on) = 6.1 mΩ at VGS = 10 V, ID = 44 A; High performance technology for extremely low rDS(on); 100% UIL Tested; RoHS Compliant

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PCB Footprints
NTMFSC006N12MC - onsemi PCB footprint - Other - Other - DFN8 5x6.15 1.27P, DUAL COOL CASE 506EG ISSUE D
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3D Models
NTMFSC006N12MC - onsemi  - 3D model - Other - DFN8 5x6.15 1.27P, DUAL COOL CASE 506EG ISSUE D
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NTMFSC006N12MC Details

  • Manufacturer Part Number:

    NTMFSC006N12MC

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-8

  • Package Description:

    QFN-8

  • Manufacturer Package Code:

    506EG

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.2

  • Additional Feature:

    ULTRA LOW RESISTANCE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    120 V

  • Drain-source On Resistance-Max:

    0.006 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

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NTMFSC006N12MC Overview

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