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NTNS0K8N021ZTCG - onsemi

Description: Low Profile Ultra Small Package, XDFN 0.42x0.62x0.4mm; Pb-Free, Halogen Free, and BFR Free

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NTNS0K8N021ZTCG - onsemi - PCB symbol
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PCB Footprints
NTNS0K8N021ZTCG - onsemi PCB footprint - Other - Other - XDFN3 0.42x0.62, 0.3P CASE 711BH ISSUE A_2023
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3D Models
NTNS0K8N021ZTCG - onsemi - 3D model - Other - XDFN3 0.42x0.62, 0.3P CASE 711BH ISSUE A_2023
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NTNS0K8N021ZTCG Details

  • Manufacturer Part Number:

    NTNS0K8N021ZTCG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    XDFN-3

  • Package Description:

    XDFN-3

  • Manufacturer Package Code:

    711BH

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.22 A

  • Drain-source On Resistance-Max:

    1.8 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N3

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.125 W

  • Surface Mount:

    YES

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTNS0K8N021ZTCG Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to the onsemi application note AND9173/D for more details.
  • The device requires a stable input voltage (VIN) and a proper bias voltage (VBIAS) to operate within specifications. Ensure VIN is within the recommended range (4.5V to 18V) and VBIAS is set to 1.2V ± 0.1V.
  • The maximum power dissipation (PD) is 1.4W. Ensure the device is properly heat-sinked and the ambient temperature is within the recommended range (-40°C to 150°C) to prevent overheating.
  • Yes, the NTNS0K8N021ZTCG is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure you follow the recommended operating conditions and guidelines for these applications.
  • Consult the onsemi application note AND9173/D for troubleshooting guidelines. Common issues include incorrect biasing, inadequate heat sinking, or exceeding the maximum power dissipation. Verify the device is operated within the recommended specifications and follow the recommended PCB layout.

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NTNS0K8N021ZTCG Overview

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