Part Image

NTR3C21NZT3G - onsemi

Description: RoHS Compliant; Ultra Low RDS(on) in SOT−23 Package; Advanced Trench Technology

Download NTR3C21NZT3G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
NTR3C21NZT3G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
click to zoom
3D Models
NTR3C21NZT3G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
click to zoom

NTR3C21NZT3G Details

  • Manufacturer Part Number:

    NTR3C21NZT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

  • Package Description:

    SOT-23, 3 PIN

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.07

  • Additional Feature:

    ULTRA LOW RESISTANCE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3.6 A

  • Drain-source On Resistance-Max:

    0.024 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.47 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTR3C21NZT3G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended. Refer to the onsemi application note AND9173/D for more details.
  • The device requires a stable voltage supply and proper biasing to ensure optimal performance. A voltage regulator and decoupling capacitors are recommended to ensure a stable supply voltage. Refer to the onsemi application note AND9173/D for more details.
  • The NTR3C21NZT3G is rated for operation from -40°C to 150°C. However, the device may be operated at temperatures above 150°C for short periods of time, but this may affect the device's reliability and lifespan.
  • The NTR3C21NZT3G has built-in ESD protection, but additional protection measures may be necessary depending on the application. It is recommended to follow proper ESD handling procedures and use ESD-protective packaging and materials.
  • The device should be stored in a dry, cool place, away from direct sunlight and moisture. It is recommended to follow the EIA/JESD625 standard for handling and storage of semiconductor devices.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

NTR3C21NZT3G Overview

Use the download button to access the NTR3C21NZT3G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NTR3C, or try a keyword search, such as Small Signal Field-Effect Transistors

Parts related to NTR3C21NZT3G

Showing 0 results