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NTS4101PT1G - onsemi

Description: Leading -20 V Trench for Low RDS(on); -2.5 V Rated for Low Voltage Gate Drive; SC-70 Surface Mount For Small Footprint (2x2 mm)

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PCB Footprints
NTS4101PT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - sc-70
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3D Models
NTS4101PT1G - onsemi  - 3D model - SOT23 (3-Pin) - sc-70
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NTS4101PT1G Details

  • Manufacturer Part Number:

    NTS4101PT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70 (SOT-323) 3 LEAD

  • Package Description:

    LEAD FREE, CASE 419-04, SC-70, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    419-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    1.37 A

  • Drain-source On Resistance-Max:

    0.12 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    85 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.329 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTS4101PT1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal relief pattern are recommended to ensure good heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to maintain a low junction temperature. Monitor the device's thermal performance and adjust the system design as needed.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge. Follow the recommended PCB layout and handling procedures to minimize ESD risks.
  • Optimize the device's power consumption by minimizing the input voltage, reducing the switching frequency, and using a low-power mode when possible. Use a power management IC or a low-dropout regulator to minimize power losses.
  • Use a soldering temperature of 260°C (max) and a soldering time of 10 seconds (max) to prevent damage to the device. Follow the recommended soldering profile and use a solder with a melting point above 217°C.

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NTS4101PT1G Overview

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Part Image NTS4101PT1 onsemi

Small Signal Field-Effect Transistor, 1.37A I(D), 20V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET