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NTZD3152PT1G - onsemi

Description: Low RDS(on) Improving System Efficiency; Low Threshold Voltage; ESD Protected Gate; Small Footprint 1.6 x 1.6 mm; RoHS Compliant

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NTZD3152PT1G - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT-563 6 LEAD CASE 463A-01 ISSUE O
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NTZD3152PT1G - onsemi  - 3D model - SO Transistor Flat Lead - SOT-563 6 LEAD CASE 463A-01 ISSUE O
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NTZD3152PT1G Details

  • Manufacturer Part Number:

    NTZD3152PT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-563, 6 LEAD

  • Pin Count:

    6

  • Manufacturer Package Code:

    463A-01

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.8

  • Additional Feature:

    ESD PROTECTION, LOW THRESHOLD

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.43 A

  • Drain-source On Resistance-Max:

    0.9 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    20 pF

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.28 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTZD3152PT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage, current, and power ratings. For NTZD3152PT1G, the SOA is limited by the maximum voltage rating of 150V, maximum current rating of 15A, and maximum power rating of 225W.
  • Use ESD-protective packaging, handling, and storage procedures. Ensure that the device is handled in an ESD-controlled environment, and use ESD-protective devices such as wrist straps and mats.
  • Use a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. Ensure that the device is not exposed to temperatures above 300°C (572°F) during soldering.

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NTZD3152PT1G Overview

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